Denseo HIQ-Bonder 3g

Denseo HIQ-Bonder.

Zirconium bond, facilitates the application and firing of ceramics on a zirconium structure.

Use:

• The bonder is applied in a thin, even layer to the clean zirconium.

Firing parameters:

• Initial temperature 500°C;
• Drying time 4 minutes;
• Temperature increase 65°C / min;
• Final temperature 1050°C;
• Hold time 1 minute;
• Vacuum (Start/Stop) 500°C / 1050°C.

Packaging:

• 1 pc.